Inverter housing on the assembly line in the cleanroom at BMW Group Plant Steyr, which will assemble the Gen6 inverter power module from 2029
Wafer of Lynred CAPT640 thermal imaging sensor dies, sold as bare die for automotive camera integration
Aptiv new-generation integrated front-view ADAS unit powered by the Axera M57 SoC
Two Nexperia X.PAK packaged silicon carbide power devices, from the wide-bandgap portfolio behind the GaN power semiconductors collaboration with Aurobay Technologies.
ROHM 4th generation automotive 650V IGBT devices in TO-247N and TO-247-4L packages shown with an IGBT wafer
TIER IV and Renesas logos marking the collaboration on an open AI-native computing platform for software-defined vehicles
Russell Ruben, Technical Segment Marketing Director at Sandisk, author of this Insights piece on automotive flash storage
Wolfspeed YM4 SiC power module — traction inverter six-pack used in 800-volt EV powertrains
Compact GaN on-board charger prototype from Fraunhofer IZM, the 22 kW HiPower 5.0 demonstrator using bidirectional gallium nitride semiconductors.
diamond semiconductor

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